Cho-Bond 4660/4669

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 CHO-BOND®4660和4669 ONE COMPonENT FLLEXIBLE导电聚异丁烯密封剂。 CHO-BOND 4660是一种镀银铜填充的单组分导电聚异丁烯。 它设计用作电气外壳上的圆角，间隙填充物和接缝密封剂，用于EMI屏蔽或电气接地。
CHO-BOND® 4660 and 4669 ONE COMPonENT FLEXIBLE ELECTRICALLY ConDUCTIVE POLYISOBUTYLENE SEALANT. CHO-BOND 4660 is a silver-plated copper filled, one-component conductive polyisobutylene. It is designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding.