Cho-Bond 584-208

手机版链接：https://m.trustexporter.com/cz4938627.htm
 粘合剂为电路板维修提供了极其简便的应用。 它是一种双组分体系，混合比为1：1，在室温下24小时固化。 在0.75小时的高温固化温度212°F（100°C）下，该材料的体积电阻率为0.005欧姆 - 厘米。
Adhesive offers exceptional ease of application for circuit board repair. It is a two- component system with a 1:1 mix ratio, and cures in 24 hours at room temperature. With a 0.75 hour elevated cure temperature of 212°F (100°C), the material offers volume resistivity of 0.005 ohm-cm.