Product Name: DOPO
Price: US$
Detail: Dopo, Flame-retardant advanced epoxy resins and cured epoxy resins which contain a rigid phosphorus group and thus provide better thermal and flame-retardant properties than the conventional epoxy resins prepared from tetrabromobisphenol A. The advanced epoxy resins are suitable for making a fiber-reinforced epoxy resin composite which is useful in the fabrication of printed circuit boards. The cured epoxy resins can be used in semiconductor encapsulation applications.
Product Name: 9,10-Dihydro-9-oxa-10-phosphaphenanthrene-10-oxide
Synonym:6H-dibenz [c, e] [1, 2] oxaphosphorine-6-oxide
CAS: 35948-25-5 (TSCA, EINECS : registered, 2528137)
Molecular Formula：C12H9O2P