Product Name: SBQ sensitizer
Price: US$
Detail: Chemical Name: Symmetric formyl ben-ethylene cymene pyridinium methyl sufate.

molecular formula:C16H17N05S
Molecule Weight: 335.37
Properties: Bright yellow, even solid powder, fantastic water–solubility. The maximum of absorption is 342nm.
Applications: Used as compound meterial of water solubility photosensitive coatings. Mainly used for production of silk printing photogelation. Better character than binary diazo powder , for it is high stable without any dark reaction, higher photosensitization and thermal stability
Package: 1kg/5kg black plastic barrel
SBQ’S Applications:
1) organic vinylpyridine resin (SBQ photosensitive resin) Add resistant water –solubility resin with other auxiliary, SBQ photosensitive resin can make out single-fluid style of resistant water –solubility SBQphotosensitive resin for production of silk printing plate, through which can be used for water solubility Printing Inks. sizing material mucilage glue. printing material ect. Printing Image on textile ,clothes, towel paper have strong points of high senitization, good sharpness of separation , smooth surface.
2) organic vinylpyridine resin (SBQ photosensitive resin )Add resistant solvent –solubility resin with other auxiliary, SBQ photosensitive resin can make out single-fluid style of resistant solvent. SBQ photosensitive resin, for production of resistant solvent printing ink plate, which can be used for solvent printing inks, Such as antiwelding printing ink, relief printing ink , pile coating printing ink. Plactic soluble printing ink, froth printing ink and so on, it is mainly used for printing products : PCB, Meter, AD brand plate, all kinds of brand, nameplate, decal paper, plastic, glass, metal, leather and ect.
3) organic vinylpyridine resin (SBQ photosensitive resin) can be supplied for the use of offset printing

Advantages of SBQ :
1)easy to use, it is single ?fluid style, which can be directly used for coat fabric nylon screen plate without any further dispensation.
2)Good thermal stablity. I